All beneficiariescompanyNetwork Hardware ManufacturersIdeas that could help Network Hardware ManufacturersUltra-Compact 200G QSFP Transceiver ChipletA high-density silicon photonic transmitter chiplet that combines mode-division-multiplexing (MDM) and wavelength-division-multiplexing (WDM) to achieve 200G capacity within a minimal physical footprint.Why it helps: Enables the production of more competitive, compact 200G QSFP modules using a standardized chiplet architecture.