Chinese Optics Letters
· 2026 · 1438 citationsRead the paper
In this Letter, a four-channel silicon photonic mode-division-multiplexing (MDM) and wavelength-division multiplexing (WDM) transmitter chiplet is proposed over a 1.65 mm 2 footprint, utilizing add-drop micro-ring modulators to simultaneously achieve electro-optic modulation and two-wavelength multiplexing.A dual-mode grating coupler with a side-distributed Bragg reflector for equalized two-mode coupling is realized with high chip-to-fiber coupling efficiency, so as to support the MDM optical fiber interface.A high data rate of up to 4 56 Gbps signaling is experimentally demonstrated, featuring applications like 200G quad small form-factor pluggable (QSFP) transceivers and indicating significant potential for highdensity and large-capacity 3D co-packaged optical interconnects through flip-chip-based electronic-photonic packaging.
1 idea Seedlabs derived from this research
A miniaturized silicon photonic transmitter that combines wavelength and mode multiplexing to deliver 224Gbps of data throughput within a 1.65mm² footprint. The design leverages microdisk resonators and topological pumping to ensure high bandwidth and fabrication robustness.
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